Solving Manufacturing Problems at the Sub-Micro and Nano Scale

For Executives... with strategic imperatives to reduce microsystem packaging costs.

Invenios provides high-throughput microsystem alignment/assembly platforms and quick-turn 3-D micromachining services on glass-ceramic substrates that together deliver fast time-to-market and reduced part count at the lowest possible package costs and tooling investment. More...

For Design Engineers... in need of quick-turn micro fabrication services on true-3D designs requiring sub-micron precision.

Invenios' foundry services deliver micromachined glass-ceramic components directly from solid model design files. Using Invenios' proprietary direct-write (mask-less) technology-enabling integration of optical, mechanical and packaging functionality — our foundry delivers prototype and production components with reduced component count within days after receipt of order, usually without NRE. More...

For Systems Integrators... in need of robust nano positioning components and platforms for fast deployment of production assembly equipment.

Invenios provides a broad line of configurable ball-screw and piezo-flexure component and platform solutions that deliver high structural stiffness while at the same time providing the nanoscale resolution necessary to align and position microsystem components in demanding military and consumer applications. By using Invenios' PC-based component and platform solutions, systems integrators and machine builders will shorten the delivery and qualification of high-performance microsystem assembly systems. More...

Advanced Capabilities

Invenios is a manufacturer of precision linear and rotary stages, anthropomorphic platforms and true 3D dynamic MEMS contract manufacturing; serving a broad range of traditional and emerging micro manufacturing applications-all with one thing in common…they require fast, dependable, nanoscale precision of alignment and assembly in the smallest possible footprint.